5G Infrastructure Solution
Siemens has announced a major update to its industrial-grade private 5G infrastructure solution, enabling manufacturers to cover larger industrial spaces with enhanced connectivity capabilities.
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Author: Melina Hosseinli
Intelligent Link Module To Boost Industrial Automation Data Transparency
With the Sirius 3RC7 intelligent link module, Siemens now offers a quick and easy way to gain complete data transparency down to the field level. The plug-and-play expansion module combines information technology (IT) and operational technology (OT) with minimal installation and commissioning effort.
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Olyolefin Plant Outputs More Than 4 Tonnes per Hour
the new Intarema 2325 sees the world’s leading manufacturer of plastics recycling systems grow its post-consumer series to enter a new dimension in recycling. The Intarema 2325 T-VEplus RegrindPro with laser filter is the largest system ever built to recycle polyolefin regrind and marks a milestone in the very latest recycling technology.
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High-Performance Ppa for Next-Generation Igbt Semi-conductors
For next-generation power electronics, BASF has developed a polyphthalamide (PPA) that is especially suited for manufacturing housings of IGBT (insulated-gate bipolar transistor) semi-conductors.
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Certified for Secure Product Development
In October 2024, TÜV Rheinland, the German Technical Inspection Association in the Rhineland region of Germany, certified the secure product development process at Endress+Hauser in accordance with the IEC 62443-4-1 security standard, maturity level 3. Five product centers have received the certification and thus meet the requirements for the life cycle of the products.
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